Effect of interstitial compounds in controlling thermal contact conductance across pressed joints at cryogenic temperature and low contact pressure

Heat transfer across pressed joint is significantly governed by thermal contact conductance which in turn depends on thermophysical properties of materials contact, surface properties, pressure, working temperature and interstitials present at the interface. Application an effective technique to control ambient temperature. In study, joints cryogenic presence like silicon based conductive compound, epoxy adhesive layer acrylate anaerobic sealant are explored. These have different characteristics retain their The investigated for low pressure applications, difficult. Specimens made from compatible alloys namely Aluminium alloy AA2219, Stainless steel AISI 321 Titanium Ti6Al4V with a roughness 0.9 µm. Each interstitial applied all six similar dissimilar formed between evaluated experimentally. Investigation carried out over range 150 K 300 K, 140 kPa. compound enhances up 25 times that bare while 8 times. coating reduces about 50%. Based results, monograms generated enhancement factor observed.